Leong, Ching Chia, Universiti Sains Malaysia, Malaysia
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Vol 10, No 1: February 2021 - Special Invitation
Hardware-software partitioning using three-level hybrid algorithm for system-on-chip platform
Abstract PDF
Bulletin of Electrical Engineering and Informatics (BEEI)
ISSN: 2089-3191, e-ISSN: 2302-9285
This journal is published by the Institute of Advanced Engineering and Science (IAES) in collaboration with Intelektual Pustaka Media Utama (IPMU).