Optimized indoor radio signal prediction with 3D ray tracing model at 2.4 and 5 GHz
Saed Tarapiah, Batoul Sulaiman, Emad Natsheh, Shadi Atalla, Suleiman Abu Kharmeh, Abdallah Rashed
Abstract
Channel propagation models are essential in developing efficient wireless communication networks. Indoor propagation relies on the nature of the surrounding environment. Therefore, many researchers have provided different ways for effective propagation modeling and received power prediction. In this paper, ray-tracing-based site-specific propagation models are presented. The actual measurements are obtained using many wireless access points (AP) based on IEEE 802.11 with different technologies a/b/g and n as transmitters and mobile phone with a proposed mobile application used as a receiver to collect the power at different locations called reference points (RPs), these measurements are done without the existence of people movement. The simulation results are obtained using wireless InSite simulator depends on 3D shoot and bounce ray (SBR) method. The simulation measurements are assessed by comparing it with the actual measurements and they analyze statistically such that the correlation coefficient R between them reaches up to 80% which is an indicator to an acceptable agreement. Path loss characteristic affected by the building materials and distance along the receiver’s route is evaluated.
Keywords
3D ray tracing; Indoor propagation; Path loss; Received signal strength indicator; Wi-Fi 2.4/5 GHz; Wireless InSite
DOI:
https://doi.org/10.11591/eei.v14i4.9441
Refbacks
There are currently no refbacks.
This work is licensed under a
Creative Commons Attribution-ShareAlike 4.0 International License .
<div class="statcounter"><a title="hit counter" href="http://statcounter.com/free-hit-counter/" target="_blank"><img class="statcounter" src="http://c.statcounter.com/10241695/0/5a758c6a/0/" alt="hit counter"></a></div>
Bulletin of EEI Stats
Bulletin of Electrical Engineering and Informatics (BEEI) ISSN: 2089-3191 , e-ISSN: 2302-9285 This journal is published by the Institute of Advanced Engineering and Science (IAES) in collaboration with Intelektual Pustaka Media Utama (IPMU) .